Innovation Cooling's Diamond 7 TIM test results

[123bob]

Another point- I have not looked it up but Intel has some tolerance spec somewhere on IHS flatness that probably would correlate with a TIM thickness requirement. You are never going to mate to parts closer together than the particle size of the compound. I could envision having a void that when filled with compound the particle size would be higher then the non compounded contact. That's a thought to chew on The contact areas become voids? Maybe we should be sandblasting the IHS Instead?

An interesting thought....

When Intel produces a batch of processors the are not all the same some are 3.2's others are 2.8's etc. and are sorted into separate bins according to performance, none are perfect. Diodes are the same, they function in a engineered range of use, some read higher some read lower and some may or may not be perfectly linear across a range but they perform the intended job. I believe that picturing them as a drop dead temp indicator might be like leaning on a reed and maybe the design intent is just to keep users from burning up their CPU?

123bob, it would be interesting to go for the better contact. You own a Temp meter? I could cut a groove for a thermocouple. It would be interesting to take a no result CPU and compare it to one that has a optimum result vs diode measurement.

I would have to agree that Intel's interest is in not burning up the CPU rather than using the diodes for some kind of quantitative analysis. Otherwise they wouldn't go through such pains to tell folks how to measure temps on their products. None of which involves using the internal diodes...

I do not own a temp meter. The internal diodes are the best I can do here.

I think I'll tear the thing apart and re-film it to see how consistent the contact is. Then for the last film, perhaps use some TIM on it and see what it looks like? That will burn up the last of my film and then I'll send all 5 samples back to you. Sound like a plan?

Regards,
Bob