Quote Originally Posted by 123bob View Post
This would say that for TIM testing, the lab setup is the way to go and the testing we do is really more about the mount efficiency and characteristics. The pressure film testing is a very good addition for this purpose. (Side note - Tasty, just for completeness, I would be curious to see what a film test of your lab setup would look like. Would it be a relatively solid patch in the contact area of the test rig? )

That said, I'll move on to the Fuzion machines when I get more film.
I totally agree, we are just testing our mounts and not the TIM. Without a controlled and constant pressure on the IHS we are just "taking a wack at it". And then because each chip can be so different in the IHS and the soldering there of that also invalidated the testing to a degree. just my thoughts.