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What really puzzles me is that I DID leave the center high spot unchanged. I took off only the edge profile. Seeing that the CPU and TRUE are both convex, I would have expected to see a spot in the middle with the film....I will use another film on this, before I do another step. That will leave me with one film left for other testing.
What do you think my next step should be? Should I lap both CPU and TRUE as flat as I can get? (hehe, I still have a shot at winning the "max contact contest" here...
Right now, it looks like Bail is still in the lead...)
I do find is curious that the temp change compression is greater at the load values than idle. It does make me wonder about the diode/software linearity.
Trying to get a handle on the variables and attempting to control them has proven to be a daunting task in this exercise....
Regards,
Bob
Last edited by 123bob; 04-30-2008 at 09:34 AM.
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