There are all sorts of things Intel and AMD haven't done that they could start doing if they so desire.
And how exactly do you make a rectangular region that fits 5 modules but not 6? Why do you think there have been no 3-module dies proposed?
Have you seen Bob Colwell's lecture for Stanford's EE380 colloquium, where he talks about how shrinking the Pentium's FPU had no impact on die size? "If you take out Kansas, North Dakota and Texas are still the same distance apart!"




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