Quote Originally Posted by SoulsCollective View Post
Surface area. That die is damn small and has no crenelations, fins, pits, grooves, anything to increase surface area. Although you are removing all those possible sources of inefficiency in thermal transfer, which should count for a pretty significant temp decrease, it's oversimplifying things to say that there is no possible way this could not work.
That same damn small die is just as small when in contact with a copper water block. There is no way to increase the die size post manufacture. Adding material to the top of the die will only make it transfer heat less efficiently.

The only positive thing the block lends to the equation is a greater thermal mass than an equivalent volume of water. Flow and pressure will be the limiting factors in the capabilities of hot-side heat exchange in this direct die design.