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Its my fault.. and no im not sorry about it either.[12:37] skinnee: quit helping me procrastinate block reviews, you asshat. :p
[12:38] Naekuh: i love watching u get the firing squad on XS
Awesome idea man, I did this for a science fair project last year. Mine was much different though, didn't require removing the IHS.
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Great way to save $10 on WC block!
I'm impressed!
brass balls dude. i can't wait to see this.
"If we hit that bullseye, the rest of the dominos will fall like a house of cards. Checkmate."
Thanks everyone!I might just take some advice here and fashion some sort of hold down bracket for the block. I have a couple 1366 top brackets so it shouldn't be hard to rig something up. If the acetal were to pop off the IHS dring operation, things would get real ugly!
Better safe than sorry.
Well, I was seeing 70C+ with the setup in my sig, all I'm hoping for reasonable temps at 4.5GHz!
Yes, that would be priceless!
I tested the CPU, yes. It's a great clocker but limited by heat. Other than that though, I'm running blind here...lol!
Just straight water here. I crunch with this rig 24/7 so I'm not looking for anything too high maintenance or power hungry.
I figure I can make 30 or 40 blocks out of the material I bought, so that's about $1 each.But the real reason I did this is because traditional waterblocks wern't cutting it. I have a great clocking chip here but the heat was out of control.
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mmmmm you can just picture them making chips for this purpose that have pins or wavy patterns machined right into the top of the die itself. Wonder how thick the metal is there.
This is very cool. Can't you do this for other CPU's too? like c2d's and some amd chips? Because If this works really well I could see some people copying this idea!
CPU:Q6600 G0 @ 3.825
Motherboard:Asus P5E X38
Memory:2x2GB OCZ Reapers DDR2 1066
Graphics Card:Asus 4850
Hard Drive:2xSegate 500gb 32MB Cache raid0
Power Supply:Xion 800W
Case:3DAurora
CPU cooling: D-tek Fuzion V2 (Quad insert removed)
GPU cooling: mcw60
Monitor:24" LG
It is great to see people with EXTREME innovations(***) since now a days WC has become somewhat of a generic, dull and simple thing to do, i hope everything goes well and you chip has not suffered any damages.
Ci7 Wimpy
Nice, but I would be very scared that the force from the tubing would rip the block apart, atleast with no hold down thre is no way i would use 1/2 :O
Thought I'd throw this in, too for reference:
http://www.spodesabode.com/archive/c...ticle/dunkchip
http://www.spodesabode.com/archive/c...cle/directdie1
This quote may also show a risk you may want to consider:
I direct die cooled my cpu - it was a 800Mhz duron, and i kept it at almost ambient, this continued well (appart from the bridges disconecting) till i decided to change the water in the computer - after that my processor never worked again, i think the cpu because porus when it was exposed to air.
I'm still here, haven't fried everything yet!My fittings showed up but other matters took priority today, so hopefully tomorrow I can get it installed. I did manage to fab up a little hold down plate, nothing fancy, just enough to put some downward pressure on the block and counteract the forces of the tubing. I think it's a non-issue but better safe than sorry!
The Jew (Raven),
Yes, I do have fears that the wafer is pourous. It appears to be epoxy coated but who knows? Hindsight is always 20/20 but I wish I had pumped the IHS full of silicone so the water couldn't touch anything except the core. The core itself will be fine, it's basically a piece of glass anyways...lol!
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Keep us updated!
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I'd be concerned over the surface area the die presents and the amount of heat you have to dissipate.
I don`t really see why that should be more of an issue here than with a normal waterblock or heatsink?
Hmm, hopefully the water`s high heat capacity will make up for that somewhat, question is: how much.
You should consider narrowing the entrance of the water in order to accelerate it at the entrance of the "block" or just before the die. As more speed you get there, more performance you will have.
I have only one serious concern with the design, there's no inlet or outlet. I see this possibly causing a "boundary layer" of water to form over the die and not allowing fresh, cooler water direct access to the die.
Circles SucQ!
If your annoyed by sigs telling you to put things in your sig, then put this in your sig
Bribery won't work on me...just say NO to AT!!!
CPU:Q6600 G0 @ 3.825
Motherboard:Asus P5E X38
Memory:2x2GB OCZ Reapers DDR2 1066
Graphics Card:Asus 4850
Hard Drive:2xSegate 500gb 32MB Cache raid0
Power Supply:Xion 800W
Case:3DAurora
CPU cooling: D-tek Fuzion V2 (Quad insert removed)
GPU cooling: mcw60
Monitor:24" LG
This could also been done using Fluorinert as coolant, which would negate the need for the contact points to be sealed with epoxy. May even have a go myself come to think of it.
My god, you're brave.
You should try suggesting this to microsoft and see what they say. Although you should see if the idea is patented already.
This could make your career if it works.
Wow...that's awesome!
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