Quote Originally Posted by fallwind View Post
In a tradition WC setup, you have 4 layers of material the heat has to transfer through to reach the water (core>>solder>>IHS>>TIM>>waterblock>>water) Here it will be straight from the core to the water. I see no possible way that this won't be a HUGE improvement.
Surface area. That die is damn small and has no crenelations, fins, pits, grooves, anything to increase surface area. Although you are removing all those possible sources of inefficiency in thermal transfer, which should count for a pretty significant temp decrease, it's oversimplifying things to say that there is no possible way this could not work.