Quote Originally Posted by fallwind View Post
I see what you are getting at. In a normal cooling setup, the heat is transferred to a larger area before being absorbed by the water. I looked it up and water has a thermal conductivity of 0.6, copper is 400. So copper is definitely better at transferring heat than water. But all that is meaningless when you have to use a TIM that has a thermal conductivity 3. http://en.wikipedia.org/wiki/Thermal_conductivity Maybe the ideal solution would be to solder the core directly to the waterblock? I don't know, maybe someone with a background in thermodynamics can pop in here and explain the science behind it.

In a normal water cooled setup you would be transferring heat from die to solder to IHS to TIM to copper to water to copper (or aluminum) and finally to air.

You removed the first 4 from the equation, I think this is one of the best experiments I have ever seen! With the flow you are planning for this I think it will work well and am looking forward to seeing it's conclusion.