Sorry for the delays guys, I set up a temp loop to leak test the block and discovered a microscopic leak between the block and IHS. I don't know how it happened since I wasn't exactly skimpy with the epoxy. Anyways, it may have been for the best since I managed to remove the block fairly easily. The epoxy I used wasn't so great afterall.

I took this opportunity to pump some silicone into the IHS and hopefully seal the wafer from the water chamber. Maybe not necessary but it can't hurt. After that dried I cleaned up the mating surfaces and stuck it together with JB Weld this time. Gotta let that cure for 24 hours before another leak test.

Quote Originally Posted by prava View Post
You should consider narrowing the entrance of the water in order to accelerate it at the entrance of the "block" or just before the die. As more speed you get there, more performance you will have.
There's a 3/8" OD Swiftech plastic hose barb screwed to the underside of the inlet inside the block. You can sorta see it through the exit hole it in the last pic I posted. I trimmed the barb so it terminates about 1/4" away from the core. Trust me, the core will get scrubbed hard by the incoming water. I have a D5 with Detroit top powering the loop for plenty of pressure.

In a tradition WC setup, you have 4 layers of material the heat has to transfer through to reach the water (core>>solder>>IHS>>TIM>>waterblock>>water) Here it will be straight from the core to the water. I see no possible way that this won't be a HUGE improvement.