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Thread: AMD turns TSMC into a CPU manufacturing giant

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  1. #35
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    Quote Originally Posted by vitaminc View Post
    I guess that's the reason why AMD can't compete because it has lower revenue than TSMC and much less profitable at the same time.

    So what was your point? AMD should stay in IDM model compete against Intel in both process technology and design? Makes so much sense when it can't even rival TSMC for both revenue/profit.
    AMD needs its own factories to compete against Intel. And TSMCs process is cheaper and alot different. What part of that didnt you understand? Do you even know how many fabs TSMC got and what kind? The issue for AMD is 180nm CPUs dont sell well!

    Quote Originally Posted by vitaminc View Post
    You meant I made absolutely no sense because Intel started its business making DRAMs, got almost wiped out by other 'cheap' and 'low cost' manufacturers, and found nirvana in their single IBM design win?

    Last time I checked, Samsung's 2008 semiconductor CapEx is $8.3Bn but Intel's CapEx is $5.2Bn. So much for extremely cheap and simiple production lines!!! Unless my math or data goes wrong somewhere but $8.3Bn is more than $5.2Bn.
    Samsung semiconductor makes what and how much? Intel makes what and how much? Samsung Semiconductor makes alot and alot of cheap simple devices. Along with something you forgot, LCDs!

    http://www.samsung.com/us/business/s...ochure0607.pdf

    So yes, 5.2B focused is more than 8.3B very wide and thin spread. Samsung dont even use 1B on the Logic side.

    Samsung Semiconductor is about 20B revenue, Intel 30B.

    Quote Originally Posted by vitaminc View Post
    High density => higher errors from OPC (and use of immersion), which leads to lower initial yields, assuming the same die size.
    Asume the same diesize with different density?


    Quote Originally Posted by vitaminc View Post
    Oh and btw, stop that BULK vs. SOI marketing bullcrap. Intel's 'BULK' is as much different from TSMC's BULK as from AMD's SOI. Charter's BULK/SOI and UMC's BULK are all different too. OPC models for all fabs are all different. But I guess you believe that you can take a GDS2 layout to both TSMC and UMC and expect the same chip spinning out of fabs!!!
    Read again, I said the exact opposite.


    Quote Originally Posted by vitaminc View Post
    uh, have I not already stated that there's not enough demand from TSMC's customers for high performance node for it to develop the process? Qualcomm, TI and Broadcom/Marvell are much higher volume customers than, say, Altera and Nvidia...
    And you basicly repeat what I already said. Why would TSMC change its entire business to handle a tiny tiny bit from AMD? Besides in some fanboys dreams to get a quick way to 45nm.

    You seem to skip on the reading.
    Last edited by Shintai; 05-20-2008 at 01:51 PM.
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