Originally Posted by
Exahertz
Pads
TIM is just not suited for this application
>The MOSFET blocks don't have much support except for one off-center mounting point on each end allowing it to wobble a lot. If you use TIM it could be continusily squished in many different ways that it could be moved right out from under the block.
>While using pads they will stay in place much better.
>you also cant acheive the pressure required to make good TIM contact.
>Furthermore, if you dont use a back plate there will be a little bowing and the MOSFET chips in the middle may not make any contact at all!
>pads are a lot thicker than TIM, so they will form to the bow a little better.
> the amount of cooling required to cool the MOSFET chips is minimal. so theres no need for high proformance TIM
Tip: use the pads that are removed from the original MOSFET cooler as their the perfect cut size.
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