Water cooling the Asus Maximus SE X38

[Exahertz]

Not sure what most of the MOSFET guys are doing for their blocks, TIM or pads?

Pads

TIM is just not suited for this application

>The MOSFET blocks don't have much support except for one off-center mounting point on each end allowing it to wobble a lot. If you use TIM it could be continusily squished in many different ways that it could be moved right out from under the block.

>While using pads they will stay in place much better.

>you also cant acheive the pressure required to make good TIM contact.

>Furthermore, if you dont use a back plate there will be a little bowing and the MOSFET chips in the middle may not make any contact at all!

>pads are a lot thicker than TIM, so they will form to the bow a little better.

> the amount of cooling required to cool the MOSFET chips is minimal. so theres no need for high proformance TIM

Tip: use the pads that are removed from the original MOSFET cooler as their the perfect cut size.