Quote Originally Posted by SoulsCollective View Post
Ah, you meant heat. You originally said water molecules pick up other molecules, which made me go

Assuming each molecule can pick up a certain amount of heat, taking into account inefficiencies, the more molecules you have impacting the die surface in a given period, the more heat can be removed - thermal transfer efficiency for a set silicon/water molecule pair decreases exponentially over time. Even if silicon wafers are hydrophilic, there isn't some set number of molecules that will be "allowed" to contact the surface - you've just got to overcome additional inefficiencies caused by the repulsion of X water molecules.

Although really, any hydrophilic effect will be miniscule in comparison to the surface-area issue.
okey your looking at it from the surface impact point aspect of having more flow.

Assume this, your block is a mini reservoir, which is the case of most direct die/ihs blocks.

You wouldnt have a shortage of water molecules picking up heat. Infact you would have too much water that the flow would dump the water b4 it was even 5% utilized.

In short, i think you wouldnt see any scaling of flow after u hit that critcal point like in d-tek blocks with no nozzles.

If we used your example, then all blocks would scale, however this is not the point we see. And martin also showed us that we get hardly no benifit after we pass the 2gpm mark. :P