Quote Originally Posted by 3Z3VH View Post
I thought the consensus was that direct-die wasn't as good because water did not absorb heat as quick as copper, so you need to make the water go insanely fast to make up for it.

Bringing the heat from the die to copper is more efficient than die to water, and allows you to add more surface area to the copper. Once you have more surface area, the water will pick up more heat from it at slower speeds.
so im lost in this statement.

if water cant pick up the heat from the silicon better then copper, which u are right, i think its because silcon might be paritally hydrophobic... How would increasing flow compensate since water can only pick up a set number of molecules anyhow each pass?