AMD launched three IGP chipsets in China on January 23, including the AMD 740G chipset with ATI Radeon 2100 graphics (RS740), AMD 780V chipset with ATI Radeon 3100 graphics (RS780C) and AMD 780G chipset with ATI Radeon HD 3200 graphics (RS780), while the worldwide launch of these products has been postponed to March 5, according to sources at motherboard makers.
The 740G is an upgrade of the previous RS690 chipset and therefore only supports up to DirectX 9, HyperTransport 1.0 and PCI Express (PCIe) 1.1a, but it is pin is compatible with the RS780. The chipset will target entry-level and OEM markets with motherboard pricing set around US$40-60.
The RS780 series includes two versions, the RS780 for performance/mainstream markets and the RS780C targeting lower-end markets. The differences between the two are that RS780C does not support AMD's UVD engine, Hybrid CrossFire technology or local frame buffer memory. RS780C-based motherboards will be priced around US$60-70, while RS780 boards will cost around US$70-90.
In additional news, AMD will launch one more chipset, the RX780H later in 2008 which will be pin compatible with RD790, RD780, RX780 and RX740 chipset boards. Meanwhile in 2009 the company will launch the RD890, RX880 chipsets SB800 southbridge, noted the sources.
AMD commented that in order to fulfill client demand and create a suitable product development cycle, the company has chosen China as the first region to launch its 780 chipsets. The company said that it plans to start shipping to the worldwide market in the first quarter of 2008, but stressed that it has not yet publicly announced a date.
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