It is arround
The exception is only RS780 in China.
You get HD 3870X2, HD 3800, HD 3600, HD 3400 on the market today.
From Q3 -> Q4 ATi won in mobile and desktop. That happened from Q1-Q3 2007 because bad R600 and to much delays in all products.And dont forget that the last few years ATI also managed to get certain big OEM deals but in the end of those years Nvidia usualy sold more, made more profit and grew more in the total market.
I just say that by reports ati mobile will have strong demand through 2008. And Puma help that. I continue saying that Puma is as open as Centrino is. You will end up with almost every designs with Griffin + RS780 and by hybrid crossfire lots of HD 3400 mobile.About Puma.
So now ur saying PUma isnt closed? Sorry but get your facts straight.
Maybe you should actualy look further then ur nose is long.
OEMs are completely free to use whatever they want aslong as it is on AMDs list.
And why do you post 3 links? those links are simple product presentations they say nothing about 100+ OEM deals or maybe could you point out to me were in those 3 links it says that AMD made 100+ OEM deals wich are all AMD CPU and ATI CHipset and GPU.
http://www.pcper.com/article.php?aid...e=expert&pid=3Mobility
Another very positive piece of information presented at the call was that the upcoming Puma mobile platform has already achieved 100+ design wins with major OEMs, and the platform has not officially been released yet. Puma is AMD’s next generation mobile platform, and it is a pretty radical departure for AMD.
Puma is comprised of the RS780/SB700 chipset, which features the next gen DX10 integrated graphics technology from AMD, and the “Griffin” processor. The radical departure for AMD is that this is a custom designed processor for mobile use, and not simply a desktop processor that has been fabricated with mobile steppings in mind. Griffin is essentially an Athlon X2 that is tuned for mobile use, and it has a redesigned memory controller which more efficiently handles DDR-2 with greater performance. It also has the ability to power down different areas of the chip when not in use, and can even successfully power down the memory while in a lower power state.
The RS780 is based on TSMC’s 55 nm process and features the same graphics technology in the current RV670 chip and its upcoming derivatives. It is highly cut down from the full RV670, but the performance should redefine the integrated market. At least that is what quite a few partners are saying. Considering how well the previous generation AMD 690G performed against both NVIDIA and Intel parts, we have a pretty good feeling on how well this part should work. Users certainly should not expect to play DX10 games at high resolutions, but previously unavailable DX9 games should work fine up to resolutions of 1024x768.
AMD is very excited about Puma, and apparently many major manufacturers are excited as well. 100+ design wins on a product that has yet to be released does say a lot, and if it performs as expected then others will jump on board with designs of their own. AMD sees this as a very good area of growth for itself and its partners in 2008.
Here you can see how PUMA is equal to Grifin + RS780. You can also have Intel CPUs with Vias or Sis board, but how many of them exist? Almost none.... the lion share is CPU + chip7 intel and AMD will follow that way.
For OEM is much better -> better prices, only 1 suplier, more markting, more guaraties of speed and stability, only need 1 contract with 1 manufacter (AMD), etc
Thats why I say Puma is AMD Centrino.
55nm TSMC is just a half-node of 65nm TSMC and yields at 55nm are the same as 65nm.Ofc if u have product 1 at 65nm and suddenly shrink the die size to 55nm youl get more product out of a waffer but if u compare Product A at 65nm to product B at 55nm it doesnt per definition mean that B will get more dies out of its waffer then A.
This also depends on yields and on the actual size of the die.
Also in transistor count you will notice that HD 3800 have less transistors then G92.





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