1. NB sink is usually held on w/2 'squeeze' pins. Must use needlenose pliers or forceps (locking tweezers) from the BACK of the board- squeeze together and push though board.

2. Remove the 'lack' of stuff w/ rubbing alcohol, then airgun to remove dust and blow stuff from UNDER the chip (YES there is a slight gap, since these are mounted using Ball grid methods.)

3. Silver ANYTHING is an NO-NO! Possible conductive, staining, and capacitance issues (LEAVE EVIDENCE AND VOIDS WARRANTY).
Use Artic alumina or Ceramique, avoids above problems.

4. If you decide to lap, use 220 -> 400 sandpaper: more is not relevant here due to issue listed in (5). May help some though, especially to remove anodizing (insulator) surface contacting chip.

5. Use the razor blade method (no not that one) to get a relatively even distribution of compound on the chip since (NF2/3) tops resemble dinner plates more than a flat surface. Check that you have enough by mounting w/o pushing pins back through MB, then add small drop xtra in the middle and do final mounting and pin push-through.

Should notice that NB is much warmer now if done badly b4. Shows that the NB HSF is doing it's job - dissapating heat.

End of class, certificates are to be found in you MB boxen.