The chips die because of wrong methods of removal, improper cooling or physical damage to the die or package, the missing IHS has nothing to do with it directly.
Even if you manage to remove the IHS without any physical damage and even cool it down properly, the chip might still die within 1-xxx days without any obvious reason. In this case the actual "cause of death" lies in the botched methods of removal:
Thermal shock - The chip was heated or cooled down too quickly during the IHS removal process, which caused damage to the silicon or silicon-substrate interconnects / bonding.
Mechanical stress - Excessive force was used on the IHS before the "TBC" had reached the melting point.
This caused damage to silicon-substrate interconnects / bonding.
The usual TBC (48% indium, 52% tin) used to bond the core to the IHS has liquefying point at ~120c.
This is nowhere near the temperature the chip can temporarily withstand in non-operating state.
According to Intel, the maximum short-term (>72h) STORAGING temperature for their chips is 125c.
So if you know exactly what you are doing, removing the IHS is quite safe.
Worth all the work and trouble nursing the fragile core and making custom cooler mountings for the now non-standard (height) chip?
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