It's a buffer it basically makes the DIE spread heat instead of being concentrated thus the name Integrated heat spreader.
Remove that buffer and the chip becomes far less tolerant to voltage and can spike easily.
For reference I tested this from stock volts to 1.6 where it was finally enough to spike the chip and kill it.
My intention was to kill it and also find out at what voltage for personal data.
If it can spike and kill instantly at 1.6 it can surely degrade with the buffer.
Usually voltage above 1.55 is enough to peg the chips at 55C anyway which is the overall average temp that most chips stability breaks down under high clocks @ normal ambients.
Actually compiling some interesting ln2 data as well but the data is not complete yet.






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