Quote Originally Posted by NaeKuh View Post
actually u both are correct...

Putting on my serious hat...

What your saying is that by watercooling the die itself draws less power.
Well that has to do with overall interference from heat and materials. ie.. the super conducting metal we all look for.

As things get hotter, more energy is lost via HEAT.. adur... remember physics.. nothing is for free.
This is where ur seeing all the voltage leak... its HEAT.. and a LOT OF IT.

Now in chew's case... and dont get me wrong.. im not anywhere near chew's level in knowledge.. i think its because a physical limitation inside the arch which prevented the cpu from scaling any higher.

Once again physics... u can never get something for free. and you must always play the game.. and no u can never cheat!
?

This post doesn't make any sense at all.

1) There is no such this as voltage leak. We are talking about current leak.
2) Only one of the above theories can be right. Papers and practise supports our theory that colder CPUs draw less power and as a result puts out less heat. That means that less heat needs to be removed with our cooler.
3) Wait what? Chew simply stated that because of the low die temperatures their CPU was, albeit being severy overclocked (@8GHz) and overvolted (@2V), still within the TDP.