Quote Originally Posted by jonny_ftm View Post
...The mosfets are better with the thermal pad, as the default heatsink can cause loose contact. If you kept the pad, adding a second thermal interface material (AS5) with the pad is not a good idea, in my opinion as you add interfaces, while pads assume a better contact than paste but are less conductive than a compound.

As of the heatsink above the CPU, it is for the other 4 mosfets.
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not sure I follow you. I took off the thermal pads on all heatsinks and added the nonconductive Arctic Silver Ceramique, not added to the thermal pads. The Arctic Silver Ceramique makes great contact with the mosfets as I test fitted them, and the footprint "smear" was great.

Correct me if I am misunderstanding you.
Thanks!