HUUUUGE misconception.
Okay, maybe not huge, but still a notable misconception I see at a lot of places.
Basically: yes, it may have a lower heat output per clock-volt, but because the die size is significantly smaller (and IHSs are not super functional), you cannot make generalizations about temps. Power density is no longer the same.
In fact, each HSF handles different heat-dump characteristics differently...some have very high load capacities but use it on a small chip at medium load and it can't move the heat away fast enough leading to high temps. The opposite is also true for some sinks.
And not to sound snobby or anything, but you go to phase/DI/LN2 and OC, you're largely flying blind for CPU temps--why do people rely on them so much on air/water? Heck, when B1 ES Conroes were around, we had nothing to know the temps and that didn't stop us from getting the exact same clocks we would eventually get with temp software. Practice your HSF mount, and just overclock.
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