ASUS Maximus Formula SE

[DMight]

For those who have successfully removed the motherboard heatsinks using the hairdryer method, can you give an estimate of the amount of time at high heat that was required to loosen the adhesive?
Is it possible to overheat the motherboard or MB components using the hair dryer?
I had an SE board, turned out to be bad, which I tried to get the heatsinks off to replace the adhesive with a more conductive compound and I was unable to do so. It wanted so much force to get it off that I got really nervous. I plan to try the same with my replacement Non-SE board and was hoping for a bit of guidance. Thanks.