Quote Originally Posted by BeepBeep2 View Post
So I was right to an extent?

Just like how you can have an LN2 pot with all the surface area in the world, but without mass in the base it's worth nothing? The contact and thermal transfer from die to IHS through solder is much better than paste to block/base would be and that's what kills the chip if I understand you right.
What i'm saying is If AMD thought they could get away with paste under IHS with all there current chips, Don't you think they would use it?

Indium is not cheap.