
Originally Posted by
chew*
I can only go by the results I did myself. Temps were a tad lower, the transition from load to peak temps was instantaneous way more significant than with IHS on. So take a realistic hot summer day with a dialed in significant OC in my case 4200 prime 95 stable........and boot a system "cold" where on that hot day is rather warm ( radiatior and watercooling won't help instantly ), then add to that the voltage being run for 4.2 then combine all that with XP load......which is a mother trucker, anyone that benches on ln2 knows XP boot brings the pain..........
Moral of the story in a very common everyday practice ( not everyone has a golden spoon with central air ) of booting a system the chip can and will pop.
Remember for AMD to qualify anything it has to pass the worst case scenario.....or it never happens.
The solder they use is Indium btw.
Believe me I discussed this in length with AMD when AM2+ launched.......and we ran quite a few controlled experiments.
Here's some fallout from them (experiments), that piece of foil on tray is indium.
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