Guess what's already starting?
Intel Round 2!
7 mounts per TIM, 25+ TIMs, 12 hours per mount. This is gonna take awhile, but it's worth it to get some great data on TIM
Oh, and I've added another wrinkle: test it all and then repeat again with poor contact. So yeah....it all looks like this: (7 mounts per TIM, 25+ TIMs, 12 hours per mount)*2![]()
I have a second testbed dedicated to TIM testing and know it's going to take freaking forever to get done (so I'll be releasing data in chunks of 4-7 TIMs), but it's all set up and running right now, first results should be out in a few weeks
As for the inclusion of a "Poor Contact" test, I've been hand-picking parts so that I get GREAT contact on basically every mount, but that's not necessarily representative of everybody's install. It also minimizes TIM's resistance, so all the TIMs get really similar results. This will break that open. Great, great TIMs will continue to succeed when contact is bad, while others might just fail completely. I think it's really interesting to think about....and somewhere between the "Ideal Contact" and "Poor Contact" results will be the typical contact (which I don't actually planned to test).
So how am I manipulating contact but also maintaining consistency? The same way I get great contact right now: mechanical deformation + great mounting system. For my great contact tests, I use a CPU-360 (and its wonderful mounting system) with a slightly-too-thick midplate and the result is tremendous contact. I swap the midplate for one that's slightly-too-thin and suddenly contact is very poor, but still very consistent. When the plate is slightly too thin, the pressure between the block and the IHS doesn't come at the center of both objects, but more along the edges of the IHS. This creates a slight bow (inverted to the good kind) that creates a consistent gap between the two surfaces. The gap is slight, but it is consistent and it causes the bond line thickness to increase noticeably. If a TIM can fill the space and still maintain great performance, then it means it's capable of appropriately filling gaps and its bulk thermal resistance is low. It's a worst case scenario for TIM and the inept TIMs will fail, the bad TIMs will perform worse, and the great ones will be ahead of the pack. There should be a lot more variation between great/good/mediocre/bad with this test. But it's not representative of every scenario either. But by getting numbers from Ideal Contact and Poor Contact situations, we should be able to ascertain which TIMs are worth your attention and $$ and can be used in any situation.
It's gonna take awhile to get the picture painted though
At 100% efficiency (0 time to clean and remount and boot....no missed ends....every second of the day, the test is running), it will take 25 weeks, or about 6 months. I'm expecting to run at ~85% efficiency, so about 7 months from today till the end. Lots of small answers will be answered along the way, data will be released in chunks every few weeks, etc. so it won't be the last you hear from me for the next 6 months, as I also have CPU block tests to do
Anyway, hope you enjoy what's about to come![]()
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