Quote Originally Posted by SKYMTL View Post
Q4 2010 or Q1 2011. Risk production very early Q4.

From what we have been hearing, TSMC's 28nm process is quite mature already (~60% yields @ LP and ~25% @ HKMG / HP) considering the resources that were dedicated to it when their 40nm process tanked.
But that can mean anything... what structure and die size are the test chips at? Obviously that would be excellent for a 300+mm2 complex test structure. Not so hot for a 50mm2 dram test structure