Quote Originally Posted by flutie98 View Post
Yep DRAM also uses Cu interconnects, However my feeling is that a lithographic wall will be hit before a Cu resistivity issue is. EUV Litho has been in the R&D phase for years, hopefully it will be ready when we need it.

To comment further on Ag, just looked at the price difference, roughly 5x per gram, it would add up. That being said it might happen some day.
Well, on the performance side... I don't think any of us would flinch too much at paying an extra $30 for a 22nm chip...

So then we need to totally rework the entire manufacturing process to get smaller?

If so, that could take some time...