Quote Originally Posted by Calmatory View Post
I can't remember the exact reason behind the pad limit then, if it wasn't the too small die. There was a review or an article about it, and RV770 was supposed to have 480 SPs, but was pad limited so they had "free space" to fill up and slapped 800 SPs to it. GDDR5 uses more pins which caused the bigger die to be pad limited, as far as I can recall.
Correct, GDDR3/GDDR5(GDDR4?) memory controllers, more pins for the GDDR5 due to power/ground, sideport taking up extra perimeter, UVD2 is slightly larger than the original. Let's not forget that they slightly increased the transistor density over RV670.

I also recall hearing that RV770 was pad limited in early stages.