Been discussing my hot i950 issue with Unclewebb for couple days...and we thought testing TDP/watts on my i940 C0 vs i950 D0 would help sort the difference in heat between 2 chips. At stock, max TDP per intel is 130 watts, though cpu to cpu will vary quite a bit, and batch to batch will vary, hence why intel calibrates part to part.

i940 at 4.3 ghz, 1.49 vcore, pulls 224W per everest, 590W per kill-o-watt meter for computer, load temps were 87C.

i950 at 4.3 ghz, 1.49 vcore pulls 278W per everest, 650W computer, load temps 98C within few seconds, would no doubt go higher....(only need 1.3 vcore for 4.3ghz on this D0 but used 1.49 for apples to apples comparison)

Temps measured by realtemp, TDP per everest and k/w meter in manner seen here
http://www.xtremesystems.org/forums/...52&postcount=5

When trying to cool 278W from small point source like cpu, the gradient from water (30C) to core (98C) is 68C. So even if kept water temp at 30C with massive rad (5C over ambient for me), cpu is still going to be 98C under those circumstances...unless you improve waterblock or thermal transfer from WB to IHS.

May need to solder my waterblock to IHS for 80W/M*K instead of 2-4 W/M*K of paste.

At one point, I thought maybe my i950 had bad solder attachment of IHS, but comparing TDP to TDP, temps are similar, this chip is simply pulling more watts given the exact same settings, and hence putting out more heat.

Running this thing at 4500 to 4600 you can easily get into 300+W load if vcore is high enough, so definitely using biggest rad, best WB, best fans possible within ur noise limits, to fight for every degree helps.