Quote Originally Posted by Particle View Post
That isn't the issue. The problem is that on any given wafer of silicon, there will be some random defects. The more defects there are the more cores will be bad. The fewer chips you get out of one wafer, the more silicon you waste from a single defect. If you were to develop a core that is as big as a wafer, you'd get a 0% yield. There's plenty of space in the CPU package for a large die. It just isn't a good idea since larger dies generally equate to more waste. That will drive up per-unit costs beyond where you'd expect it to linearly be judging from area.
like nvidia's G200 chip big huge die, not many on the wafer.

Rv770 no sure how many's on a wafer but I know it's above 100.