I'm just really happy to see some manufacturer tested data. Happy to see it and would encourage more....that's awesome!
I personally would like to learn more about how they do this sort of testing. All the typical questions come to mind.
- Is multiple mounting done when this sort of testing takes place?
- What sort of mounting pressure is applied?
- What sort of thermal compound is used and what method of application?
- Is the processor IHS stock or lapped?
- On the fuzion block was the quad nozzle or any nozzle used?
- The temperatures we're seeing, are they an average of core temps, or some sort of probe inserted somewhere?
- If the temps are core temperatures, which software and how long are these logged for and averaged?
- What is being used to "Load" the processor? Is there some sort of warm up time that's standard.
- What does the 30C mean, is that water temperature?
We're all struggling to figure out the best way to test these things third party, it would be awesome to better understand how it's done by the industry.
Just getting ready to start in on my second round and trying to sort out the testing methods...
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