Providing you have a modern motherboad, and most do, cpu temp is indeed read from a diode between the cores. Computronix, I agree with above, except the semantics issue of calling cpu diode a Tcase sensor. Intel will tell you to use the cpu diode to monitor Tcase specs, but it is not actually Tcase, and when you call them on it, they punt. There can be, mathematically, as much as ~15C difference between cpu diode and a sensor placed on IHS under certain testing full load TDP parameters, using intel formulas. I went round and round via email with intel via cpu temp vs Tcase (actual Tcase is IHS where no sensor exists). I already posted most of emails on anandtech, it is here. http://forums.anandtech.com/messagev...&enterthread=y
gradient goes from 1) core (~120W/m*k thermal conductance) to 2)between core (still in die material and still ~120W/m*k) and thus max gradient between core and cpu temp is ~5C on load.
gradient continues from between cores to 3) die attach solder ? ~10W/m*k (from companies that adverstise) 4) IHS over ~120w/m*k, hence most of the gradient occurs at the die attach adhesive.
So although only 5C max gradient occurs from core to cpu across 120w/m*k conductance material, a possible ?23C gradient exists under certain load, max TDP, intel cooling conditions from core to IHS center across lower conductance solder attach ~10w/m*k (if measured with sensor on IHS). (solder ball in pic below is not same as solder attach, for those looking at that)
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