Here are my first set of thermal and pressure results with more before the weekend is out.

This first riund of testing was done my Q6600 G0 at 3600 with 1.43v. Cooling is a Rev. 1 Swiftech Storm with a drilled out ThermalRight bolt-thru kit backplate. The MX2 and the first ICD7 results used the stock springs compressed almost all the way and the second ICD7 test was a "Hard mount" or no springs just wing nuts all the way down. I have tried everything I know to get the temps on the different cores to even out but 3 and 4 just refuse. I have come to the conclusion that the difference is due to poor contact/ spreading of the solder that connects the cores and the IHS.

All ambient temps were measured with a UEI DT200 + K-Type probe
All core temps were measured with RealTemp 2.24 with no Idle calibration with is why most Idle temps are below ambient.

Original MX2 ~2 Months cure time
Ambient: 23.1
Idle: 23, 25, 20, 20
Load: 41, 41, 35, 37
Mount Pictures



ICD7 with springs ~1 day cure time
Ambient: 23.2
Idle: 21, 23, 20, 20
Load:40, 40, 35, 37
Mount Pictures


Pressure test


ICD7 Hardmount ~1 day cure time
Ambient: 22.8
Idle: 21, 20, 21, 20
Load: 38, 39, 34, 34
Mount Pictures



Conclusions/ Observations
ICD7 consistently beats MX2 in my tests and from the early numbers on my E6600 it is beating ASC by a good margin also. I did notice a 1-2 degree drop in temps after a few hours with I assume is due to the thickness of the paste and the time it needs to spread. I was rather suprised by the pressure test, I had guessed that it would be relatively even because of the fairly even distribution of paste but apparently the top and bottom of the CPU are higher. Also, I found it interesting that I got the best temps on the mount with the least of the IHS covered. This could be a result of the design of the storm, which concentrates almost all of the cooling area of the block directly over the cores creating little benefit to contact outside of the cooling "patch".

I will add Thermal results from my E6600 and X2 5000+ BE later today or tomorrow.