Originally Posted by Majoram
Sorry I'm just being a big tease but I think I will correct this now before I get flamed
Anyway it's not the same board - this board is the non-SE version.
Hence the revision number change.
Sorry I'm just being a big tease but I think I will correct this now before I get flamed
Anyway it's not the same board - this board is the non-SE version.
Hence the revision number change.
*:-.,_,.-:*'``'*:-.,_,.-:*'``'*:-.,_,.-:*'``'*:-.,_,.-:*'``'*:-.,_,.-:*
GTZ --> MCW-NBMAX --> EK FC --> PA 120.3 --> PA 160.1 --> 2x DDC Ultras in Series --> Custom Clear Res
"Artificial intelligence is no match for natural stupidity."
*:-.,_,.-:*'``'*:-.,_,.-:*'``'*:-.,_,.-:*'``'*:-.,_,.-:*'``'*:-.,_,.-:*
When this revision first appeared, nobody knew where it came from.
Just wanted to confirm and let people know what it is.
Only happened by chance since I decided I would never use the water cooled board anytime soon, so I changed to the air-cooled version of the mobo.
Would be nice to see temp comparisons, because I have a feeling there wont be much difference.
OS: Microsoft Windows Vista Ultimate SP1 / Microsoft Windows XP Pro SP3
MB: Asus Maximus Formula Special Edition (BIOS Version 1302 SLIC)
Case: Coolermaster Stacker 830 / Akasa Amber Ultra Quiet 120mm (x4 Side Intake, x1 Back Outtake)
PSU: Enermax Galaxy 1000 Watt PSU
CPU: Intel Core 2 Quad Q6600, CPU Stepping G0, 3600 MHz (9 x 400)
CPU HS: Scythe Zipang / Scythe 140mm
NB HS: Thermalright HR-05-SLI
RAM: G.Skill (4 GB DDR2-1066 DDR2 SDRAM) 5-5-5-15 (CL-tRCD-tRP-tRAS)
GFX: NVIDIA GeForce 8800 GTX (621 GPU Clock, 2000 MHz Memory Effective Clock)
SND: Creative SB X-Fi XtremeMusic/Platinum Sound Card
Backplane: ICY Dock MB454SPF-B Multi-Bay Backplane Module
CD 1: Optiarc DVD RW AD-7200S SATA Device
CD 2: TSSTcorp DVD RW SH-S223F SATA Device
HD 1: WD 1002FBYS Intel Raid 0 Volume (2 TB)
HD 3: WD 5000AAKS External (500 GB)
Well i just received the board an hour now but I got other stuff to do atm.
Also I plan to take apart the assembly before turning it on though and reseat with AS5.
If I do it after turning on, I may not be able to get the assembly off. Unless someone has a suggestion?
Well if it's anything like the SE assembly, the NB should pop out too
I usually find it helpful to subject the top of hard to remove heatsinks with a bagged icecube to cool the metal, then gently twist to loosen the initial bond between the surfaces.
Last edited by devilhood; 11-12-2007 at 09:28 AM.
OS: Microsoft Windows Vista Ultimate SP1 / Microsoft Windows XP Pro SP3
MB: Asus Maximus Formula Special Edition (BIOS Version 1302 SLIC)
Case: Coolermaster Stacker 830 / Akasa Amber Ultra Quiet 120mm (x4 Side Intake, x1 Back Outtake)
PSU: Enermax Galaxy 1000 Watt PSU
CPU: Intel Core 2 Quad Q6600, CPU Stepping G0, 3600 MHz (9 x 400)
CPU HS: Scythe Zipang / Scythe 140mm
NB HS: Thermalright HR-05-SLI
RAM: G.Skill (4 GB DDR2-1066 DDR2 SDRAM) 5-5-5-15 (CL-tRCD-tRP-tRAS)
GFX: NVIDIA GeForce 8800 GTX (621 GPU Clock, 2000 MHz Memory Effective Clock)
SND: Creative SB X-Fi XtremeMusic/Platinum Sound Card
Backplane: ICY Dock MB454SPF-B Multi-Bay Backplane Module
CD 1: Optiarc DVD RW AD-7200S SATA Device
CD 2: TSSTcorp DVD RW SH-S223F SATA Device
HD 1: WD 1002FBYS Intel Raid 0 Volume (2 TB)
HD 3: WD 5000AAKS External (500 GB)
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