Hint as of when NDA on Barcelona will be lifted!

At the CTO Summit, AMD laid out a fully finished 300mm wafer to touch and photograph, and we were shown specifics on the fab rollout schedule for AMD’s 45nm process. We got an advance look at new AMD/ATI chip-set technology as well, along with a completely new and radical AMD CPU, the nondisclosures on which lift this month. AMD is not running behind Intel. It is simply not practicing reactive engineering, and if you pay attention, you’ll see that AMD’s take on 45nm process, 300mm wafers, desktop chip sets, and dual-core mobile architecture are more than mere snapshots of the marketed leading edge, which is a coat of gloss on the present. AMD, through its partnership with IBM, defines the leading edge. Watch.
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