A square quads if you double each side. If they double the core complex ore the area it would not quad.

160 CU would be like 650-700W

I dont think a chip that large would be possible with current lithography and we wont see chiplets until next year at the earliest. You would also need like a 768 bit bus with 36 ram IC, the logistics are nasty and you would have have like a 16 layer PCB. I guess you would do something like 6 stacks of HBM and you would have to have a thick interposer so you could lap it.