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Thread: 3770k IHS Removals - CPU temp dropped from 79C to 71C

  1. #676
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    Ihs Mod #2 3770K
    3229B068 - Costa Rica

    First ... knowing the edges ...


    Next...Loosening IHS ... relaxed.


    Welcome to the die!


    TIM crappy foreground, much crap to clean.


    Alcohol, swabs and liquid metal ready for action.


    Chip absolutely clean and undamaged, next stage a mini lapping the IHS inside and out


    Mini lapping inside, black rubber removed to get more pressure with the same micro die.


    Mini lapping outside, outside, to get the best dissipation of the liquid metal


    Coollaboratory inside the inner ihs + Pro Coollaboratory on the silicon surface.


    Cool laboratory Pro sobre el IHS del chip , ya cerrado listo para bootear y poner en uso.


    Next stage...tested!
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  2. #677
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    Waiting for results!!!!

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    First testing 4.8 - 1.24 vcore successful
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    4.0 Ghz @ 0.96 Vcore 26C ambient

    Last edited by hersounds; 12-28-2012 at 03:05 PM.
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  4. #679
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    Went to Micro center this morning and they had more 3032b chips which I grabbed another as my first one can do 5G at 1.34 and 5500 max. They have at least 6 more 3032b368 chips in stock.

  5. #680
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    Che hersounds, very nice buddy
    My 3770k died a honorable death, but I'm getting a replacement soonish. I'll delid and post some results here...
    I already got Liquid Pro and that same sanicol bottle lol
    Feliz a?o!

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    Is it better to put Liquid Pro on ALL INSIDE of the IHS? And also on silicone of die? Like you did on this new test?

    Or just put some on the silicone of die only?

    Seems A LOT of Liquid Pro if you put all on the inside of IHS.

    Thanks!

  7. #682
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    Just a word of warning I'd rather be told I'm wrong than see someone mess up but don't use that much LP.

    You only need a tiny bit & spread it out thin, using too much may run the risk of some of it running/dripping off the die & could potentially short a trace or drip out the gap in the IHS & damage/short something else on the board/video card.


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  8. #683
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    Small half rice grain drop on the ihs and spread it, and similar drop on the underside of the ihs and let it spread with the mounting pressure...for the top of the ihs LP is a bit evil cause it's hard to remove and erases all processor's markings, but it's optimal, specially if you lap it.

  9. #684
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    Quote Originally Posted by Ivanlabrie View Post
    Che hersounds, very nice buddy
    My 3770k died a honorable death, but I'm getting a replacement soonish. I'll delid and post some results here...
    I already got Liquid Pro and that same sanicol bottle lol
    Feliz a?o!
    thanks buddy, sorry for your chip... y excelente feliz a?o nuevo! ( happy new year )

    Quote Originally Posted by Deceit View Post
    Is it better to put Liquid Pro on ALL INSIDE of the IHS? And also on silicone of die? Like you did on this new test?

    Or just put some on the silicone of die only?

    Seems A LOT of Liquid Pro if you put all on the inside of IHS.

    Thanks!
    Yes is better put in 4 sides sillicon die - ihs inside - outside and block cooper.
    perhaps the pics is like a lot of liquid metal but is only a little dispersed,the leftovers, was absorbed by the syringe.

    Quote Originally Posted by C-N View Post
    Just a word of warning I'd rather be told I'm wrong than see someone mess up but don't use that much LP.

    You only need a tiny bit & spread it out thin, using too much may run the risk of some of it running/dripping off the die & could potentially short a trace or drip out the gap in the IHS & damage/short something else on the board/video card.
    yes this is right...but don't forget that the leftovers, was absorbed by the syringe...and the pressure of socket retention.

    Quote Originally Posted by Ivanlabrie View Post
    Small half rice grain drop on the ihs and spread it, and similar drop on the underside of the ihs and let it spread with the mounting pressure...for the top of the ihs LP is a bit evil cause it's hard to remove and erases all processor's markings, but it's optimal, specially if you lap it.
    YES.
    Last edited by hersounds; 12-30-2012 at 12:20 PM.
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  10. #685
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    one of reason i like WC, idle about 26C, Load @41C, 4.6ghz

  11. #686
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    Carelessness killed a 3770K today.

    I was expecting the black gunk holding on the IHS to be tough to cut through; on my CPU it was not. The blade went right through and nicked the corner of the die pretty good. Stupidly I never tested the CPU before removing the IHS, but i'm pretty positive this 3770K is dead. From NiB to killed in under 5 minutes.

    Be careful when starting to cut into the corner of the black adhesive, it might not be as tough as expected:


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  12. #687
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    Yes I have done that, makes a rather expensive key chain. Take your time or pay the price.

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    Quote Originally Posted by trn View Post
    Carelessness killed a 3770K today.

    I was expecting the black gunk holding on the IHS to be tough to cut through; on my CPU it was not. The blade went right through and nicked the corner of the die pretty good. Stupidly I never tested the CPU before removing the IHS, but i'm pretty positive this 3770K is dead. From NiB to killed in under 5 minutes.

    Be careful when starting to cut into the corner of the black adhesive, it might not be as tough as expected:
    I have one chip like this, it's still working fine
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  14. #689
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    I'm now the shameful owner of 2 killed 3770k's; I give up.
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    trn: two in row? what happened in 2nd round?

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    Quote Originally Posted by Church View Post
    trn: two in row? what happened in 2nd round?
    2nd CPU is on the right, 1st is on the left.

    I'm not really sure. I was rough with the brillo-pad when removing the left over black IHS-adhesive; I might have damaged something then. There is also one tiny area on the upper left where the green coating is all worn off and copper is showing, I don't see damage to the copper though. I tried re-mounting this about half a dozen times and still no luck.



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  17. #692
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    mate, saw those at ocn too...why would you LAP your die and pcb like that???
    Next time use your fingernails for removing the glue.

  18. #693
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    A Brillo pad? Why on earth did you use that? Fingernails or a creditcard are enough to remove the glue.
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    Quote Originally Posted by Zeus View Post
    A Brillo pad? Why on earth did you use that? Fingernails or a creditcard are enough to remove the glue.
    I use to use Brillo to remove all matter of crud off Copper/Stainless/Iron plate when I was young. Now using a Brillo for an Intel cpu, isn't that kind of going over the top?

    I would use a dab of Mineral Turps to loosen the black-glue/sealant and then clean it all up with Alcohol. Is there any other way to clean the pcb other than scratching it with any object, ie, like your finger?
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  20. #695
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    Doing it just with your fingernail or a creditcard is easy enough. It's not like you have to rub for hours. Got it done in less than 5 minutes. I'd rather not use any dissolvents on the pcb if i can do without.
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  21. #696
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    Last edited by hersounds; 01-08-2013 at 12:41 AM.
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    Just thought I'd share my findings...... done the roof chop to a new 3770K I got at the weekend as it was running so hot @ 4.5GHz I couldn’t watch..

    Before the chop the chip could run IBT @ DDR 2400 1.16vcore 85oC but failed @ 2666, more vcore only made things worse I suspect the chip didn’t like the temp more than the volts. After the chop temps dropped just over 20oC & now the chip is IBT stable & has been running prime torture for several hours.

    I know the chip is a bit of a chunk blower but loosing 20+oC has made a huge difference to its stability & ability to clock memory.


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  23. #698
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    frequencies and voltages are really affected by heat mainly in Ivybridge
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    Quote Originally Posted by hersounds View Post
    frequencies and voltages are really affected by heat mainly in Ivybridge
    post some 5GHz HT luv mate
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    I can not with these ambient temperatures and the antec 620 is not enough for cool 5Ghz ...

    ...but someday more cold, I can try it.
    Last edited by hersounds; 01-09-2013 at 09:51 AM.
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