Quote Originally Posted by Zaxx View Post
Does make ya wonder if a 2.5in. enclosure could handle that kinda heat even if only applied to a few cells at a time. ATM it's looking like nand rebust-ness isn't too much in question a la the 6PB 830. I'm beginning to suspect it's the controllers that can't handle the milage. hmmm...
There wouldn't be any problem with the current form factor of NAND. Baking operations would be realtively rare (once every thousand writes or so) and would only affect a few thousand NAND cells at a time. As long as the casing around the heater elements can handle the heat, it would be dissipated in milliseconds.

Maybe secure erase will become "erase and bake"