3770k IHS Removals - CPU temp dropped from 79C to 71C

[graysky]

To check tolerances between die and IHS, I would use a small piece of carbon paper or just ink the die, place the IHS on and clamp down. Remove and check underside of IHS for a nice, even, rectangular ink/carbon transfer. If you don't see it, then there is too much of a gap and the IHS bottom outside perimeter needs to be lapped on something flat to lower the IHS down closer to the die (don't lap the underside middle of the IHS).

Remember, in stock form, the IHS was sitting on a layer of black adhesive and had thick, pasty TIM to make up the gap. Since this has been removed and not replaced, the IHS needs to be lowered to be in better contact with the die.

Is that right? Draw a pic of the thing... Seems like if you remove some buffer material, the die is a fixed distance off the PCB and the inside of the IHS is also a fixed distance, so by removing the intel black sealant of height x we are effectively lowering the internal clearance between the die and the IHS by that same distance. Am I thinking about this right?

Link to full size:


EDIT: http://forums.anandtech.com/showpost...1&postcount=31