Whilst this may seem that I am having a blonde or senior moment, I would invite the thermally aware among you to pick holes in the following idea.
Currently, cooling blocks are far larger than skt 1155 ihs and I can see the advantages of this when considering barbs etc.
A number of Ivy Bridge processor matings to such blocks have shown me that the ihs is far from flat (the corners and edges seem high)
Ivy Bridge seems to have a more concentrated heat dissipation path through ihs
Would there be any advantage/disadvantage in building a block that was stepped so that whilst the overall size could remain the same the contact area could be sized to fit within the periphery of the ihs thereby obviating the need to lap the corners and edges from the processor ihs. the step would not need to be huge, perhaps a few thou to overcome ihs edge unevenness.
If the die size is 37.5mm x 37.5mm then I am proposing the contact area be 30mm x 30mm approx.
I feel that whilst this might reduce the total block to cpu contact area it would have a better chance of being a closer fit to the ihs and spring pressure would be more concentrated also resulting in thinner layers of tim so better heat transfer.
Your thoughts on this are invited




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, you are of course correct. I checked a brand new V2 last night before posting but apparently didn't have enough light when I did, just re-checked and saw that it is indeed bowed ever so slightly. Still, if I wind up getting an IB down the road, I think I'll take the risk of popping and lapping.

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