What I can“t understand from an engineering stand point:
FX-8150: 294mm²
i7 2600K: 216mm² with IGP
Of corse we don“t know the transistor count in FX-8150 or the density of Globalfoundries process, but still is a major difference in die size for less overall performance (assuming the leaks are from a final plataform).
May XOP and FMA4 be responsible for this die size?
Sn0wm@n
most drivers errors are really human errors ...
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