Quote Originally Posted by SF3D View Post
I try to be useful here
If that is true, we have two very good Lightnings....

We will try to add this additional buffer.

But with my physical understanding it makes no sense, why the card have more problems under heavy load without HS.
Because there is more thermal resistance with HS...

In case the thermal paste between DIE and HS is better then OCZ freeze we used after HS removal and can handle heavy loads better, we have to find a equivalent replacement for the thermal paste.
But then it should be fine even without HS and direct contact between DIE and pot.

Thanks for sharing your knowledge...
Andi