Quote Originally Posted by tentp0le View Post
Different cpu wafer, production sample. CPU production is divided in unequal wafers as their lifecycle advance.


In a perfect world, all end-users would get a production sample from the inner parts of the wafer, as they have the least flaws.
As you get to the outer area of the wafer the % increases, although Intel has a limit of "fault tolerance" for each batch.
So, try to get batch with the smallest last three number as possible, correct?