Erklat it seems you are implying that it is physically impossible to improve upon the TRUE, but I don't see any real justification for that besides your vague "laws of physics will not be surpassed". I know the computer industry moves fast and we've become accustomed to rapid innovation, but the heatpipe-tower style heatsink has only existed for a few years and I don't think it's unlikely that in 10 years we'll see something new. Heatpipes do a rather fantastic job of moving heat to giant fin arrays - better than solid copper in many cases! - but I wouldn't be surprised if advanced materials can push that advantage even further. For example, CNTs are over 10x as conductive as copper along their axis - maybe that could be harnessed? I also imagine there is a lot of room for improvement in fin design to help create local surface turbulence to reduce the laminar boundary layer. We've seen some 'sinks try out weird shapes and angles, others have used small dimples, but it's clearly an area for which there is opportunity for innovation.

I don't mean to be confrontational, but I think the assumption here that our current heat exchangers are the pinnacle of engineering is awfully naive. Irregardless of TFC's ridiculous marketing, I feel like applauding them for at least attempting to bring innovation to the market, rather than sitting back and assuming that our two pass fin-and-flat-tube exchangers will never be beat. I'm excited for Skinnee's results! Heck, even if you don't like supporting TFC, we'll probably see similar products from other companies if the Admiral series performs well.