Quote Originally Posted by JF-AMD View Post
Wow, that is pretty much a description of the whole bulldozer architecture. No need to double everything, only the things that matter.
Haha, but that was initially meant to explain Sandy's FPU ;-)

But perhaps that's a nice idea for some presentation slides:
double xy unit because ... <add great performance gain>
No doubled xz unit, because ... <add minor gains>.
.
.

At least if there are several doubled units ;-)

In any case, everybody is looking forward for Hot Chips.

One additional question to the die shots topic:
May we see at least a partly die-shot, i.e. of one BD module ? Like in case for Llano, where there are detailed die shots for the "K10.6" core, but not the whole Llano die, including the GPU.

thanks

Opteron