Thuban delidded

[chew*]

Cool chew* so what about heating and rapidly cooling?

I imagine it would make it worse.

If anything you would want to slow down the cooling/warming process so everything has time to adjust.

[cdawall]

I imagine it would make it worse.

If anything you would want to slow down the cooling/warming process so everything has time to adjust.

makes sense i guess the blow torch method for taking apart lga775 chips is a no go?

[chew*]

makes sense i guess the blow torch method for taking apart lga775 chips is a no go?

well even if blowtorched, cutting the IHS seal is near impossible withoutnicking smd's. Add the fact that the core is fragile ( like 50% more fragile than deneb )chances are core will crush even if delid is sucessfull.

[cdawall]

well even if blowtorched, cutting the IHS seal is near impossible withoutnicking smd's. Add the fact that the core is fragile ( like 50% more fragile than deneb )chances are core will crush even if delid is sucessfull.

i guess your right sanding down would work best. have you tested to see if there is large temp difference with a heavy lap vs none? and have you sucessfully sanded through a IHS yet?