Quote Originally Posted by Vapor View Post
I'll be lucky if I'm not doing TIM tests for the next 90 days, but I decided I want to leave as few unturned stones as possible. So here's the current list of what's going to be tested....

AM3:
MX-2, AS5, Indigo Xtreme, and potentially IceFusion (I have questions about its stability/consistency based on prelim tests). This test will be released first.

Then the long haul will set in on LGA1366, where I will be testing, in batches, the following TIMs:
AS5, AS Matrix, OCZ Freeze, Shin-Etsu X23-7783D, Shin-Etsu G751, Zalman STG1, Zalman STG2, MX-2, MX-3, Gelid GC-Extreme, Tuniq TX-3, ThermalRight ChillFactor 3, Feser H-Bridge, Scythe Thermal Elixer, Coolaboratory MetalPad, Coolaboratory Liquid Ultra, IC Diamond (yes, again...I'm giving it one more shot), Gelid GC-2 (potentially), CM IceFusion (potentially), Indigo Xtreme (hopefully)


Looking at between 20-24 tests there

I kinda can't wait to see all the data roll in
What an exhausting exercise!! hats off to you Vapor!

I'd like to see some weird stuff tested, like chewing gum, wax paper, hair jell, and finally some butter (non salted)