The GT300/Fermi Thread - Part 2!

[saaya]

So it only takes one day for TSMC to get the order, cook the wafer, get it cut, test it, send it to Nvidia to test, Nvidia to get the kits to AIBs, and AIBs to get the cards manufactured, packed and shipped?
Hmmm... I guess we dont have a facepalm smiley.

who said that? i talked about throughput, not latency... nvidia has A3 since when?
its not like they didnt have time to process the wafers, test, bin, build the cards etc
and like you said, they had quite some wafers prepared, so, assuming those werent broken beyond repair, that saved them some time as well...

Also, although we don't know the exact numbers of parked Ax wafers, those wafers have to last them until Bx is ready... which best case is end of Q2.

why? why cant they kick off new wafers? why couldnt they have done so already?

Not sure from where is this quote...

an anonymous quote of somebody promising awesome performance... how can you post something like this? at least post a link to where you found it to give it SOME credibility...

Whatever the true performance is today, you can be sure that a generation 2 fermi with 32/28 nm process will be rockin D11

why? even in 28nm gf100 will be a big chip and whos to say how good yields in 28nm are?