Is it? I don't even pour LN2 during 1M with the F1EE. For 32M I pour every ~25 seconds. I consider a ~2 degree swing to be acceptable unless it is a bleeding edge run in which case I'll trickle pour and maintain a .1C to .3C swing. 3DV CPU test on the w3570 involves a trickle pour for the first 9-12 seconds of the test after which I let the pot boil off and warm up for the load screen.
Perhaps it also comes down to the CPU you are using. My chip flips itsbelow -100C so I dance around -90C to -95C for the majority of benchmarks. I need to try one of these pots, maybe I'll borrow Brian Y's for a weekend
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